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Disco Corp.

Update in progress

6146.T (Tokyo)

  • Company RatingNeutral
  • SectorTechnology
  • IndustrySemiconductor Equipment & Materials

Disco Corporation designs, manufactures, and sells precision cutting, grinding, and polishing machines for Japan and global markets. Its product lines include dicing and laser saws, grinders, polishers, wafer mounters, die separators, surface planers, and waterjet saws, plus precision processing tools like dicing blades and grinding wheels. The company offers maintenance, disassembly, recycling, training, machine leasing, used machines, diamond abrasive tools, and chargeable processing services. Founded 1937, based in Tokyo.

Company score

Sentiment
0.23
Environment
0.00
Social
0.13
Governance
0.06
Sustainability
0.05
Impact Score
0.14
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