Xiaomi Unveils Xring O3 Chip for Upcoming Folding Phone, TSMC Partner
Xiaomi introduced the Xring O3 processor a year after launching its first proprietary Xring O1 chip, extending its push into in-house silicon. Sources say the Xring O3 is expected to power an upcoming flagship folding phone with a shipment target of 200,000 to 300,000 units. Xiaomi says Xring O1-powered devices have surpassed 1 million cumulative shipments, and smartphone industry forecasts point to a 14% decline in 2026.
Coverage (4)
- Xiaomi’s new Xring O3 is built at TSMC, and aimed at a few hundred thousand phones (thenextweb.com)
- Xiaomi Unveils Xring O3 Chip Built by TSMC (technology.org)
- Xiaomi launches new Xring chip, partners with TSMC for production, sources say (finance.yahoo.com)
- Xiaomi launches new Xring chip, partners with TSMC for production, sources say (reuters.com)