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Xiaomi Unveils Xring O3 Chip for Upcoming Folding Phone, TSMC Partner

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Xiaomi introduced the Xring O3 processor a year after launching its first proprietary Xring O1 chip, extending its push into in-house silicon. Sources say the Xring O3 is expected to power an upcoming flagship folding phone with a shipment target of 200,000 to 300,000 units. Xiaomi says Xring O1-powered devices have surpassed 1 million cumulative shipments, and smartphone industry forecasts point to a 14% decline in 2026.

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