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Xiaomi Develops 3nm AI Mobile Chip to Challenge Qualcomm and MediaTek

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Xiaomi says it has advanced its in-house Xring O3 system-on-a-chip using a 3-nanometer process, combining redesigned compute, faster memory and stronger on-device AI. The Beijing company contracts TSMC to manufacture the chips and aims to sharpen phone differentiation while reducing reliance on processors long supplied by Qualcomm and MediaTek.

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