TSMC to invest $265B in Arizona for 4nm fabs and advanced packaging
TSMC is accelerating its Arizona build-out with a further $100 billion U.S. investment, lifting total spending to $265 billion. The funding supports both front-end wafer fabs and advanced packaging facilities, with phase one using 4-nanometer technology already in production. The shift aims to improve domestic lead times and logistics for hyperscalers, even as U.S. fab construction costs run 4–5 times Taiwan’s.