TSMC to Double CoWoS Capacity to 260,000 Wafers by 2028
TSMC’s CoWoS packaging is central to AI GPU supply, and reported constraints have spilled to other providers such as UMC and Amkor. A Taiwan report cites analysts saying TSMC plans to expand CoWoS capacity to about 260,000 wafers per month by end-2028 from 130,000 this year, with production at its Arizona campus and Taiwan’s AP7 facility.