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TSMC Sets SoIC and CoWoS Roadmap for 50× AI Compute by 2029

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TSMC is advancing its technology roadmap to support surging AI HPC demand, integrating advanced process, 3DFabric, and silicon photonics into its platform. It plans N2P-on-N3P 3D integration in 2026 and A14-on-A14 in 2029, shrinking interconnect pitch to 4.5 microns. COUPE and silicon photonics aim to cut transmission loss and power, while scaling bandwidth through faster channels and wider counts as testing needs evolve for broader CPO deployment.

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