TSMC and Samsung Commit to ASML $400M High-NA EUV Chips by 2030
TSMC and Samsung plan to use ASML’s roughly $400M High-NA EUV lithography machines to produce more advanced chips by 2030. Momentum in leading-edge manufacturing was also highlighted by Intel’s High-NA processing milestone and Nvidia’s market-cap jump, while Canada’s retaliatory tariffs add strain to North American supply chains.