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SK Hynix Pushes 3-D Stacked AI Memory for Next-Gen Workloads

SK Hynix logoSK Hynix
Sig1.95Sen+3.38Env0.00Soc0.00Gov+0.45

SK Hynix is betting on 3-D-stacked chips and memory tailored to specific AI workloads as systems demand faster, more efficient storage and data movement. It describes a full-stack AI memory strategy combining 3-D-stacked DRAM, HBM, and high bandwidth flash across different workloads, and plans to work with customers from the system design stage.

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