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SK hynix plans 2028 HBM mass production at Indiana advanced packaging base

SK Hynix logoSK Hynix
Sig4.50Sen+5.21Env-0.18Soc+2.11Gov+0.67

SK hynix’s advanced packaging production and R&D base in West Lafayette, Indiana is progressing, targeting operation of a mass-production system for next-generation AI memory, including HBM, in the second half of 2028. The $3.87 billion project, supported by up to $458 million in CHIPS Act subsidies and $570 million in loans, will build capabilities like next-gen 3D packaging and hybrid bonding with Purdue R&D collaboration.

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