SK hynix plans 2028 HBM mass production at Indiana advanced packaging base
SK hynix’s advanced packaging production and R&D base in West Lafayette, Indiana is progressing, targeting operation of a mass-production system for next-generation AI memory, including HBM, in the second half of 2028. The $3.87 billion project, supported by up to $458 million in CHIPS Act subsidies and $570 million in loans, will build capabilities like next-gen 3D packaging and hybrid bonding with Purdue R&D collaboration.
Coverage (23)
- [News] SK hynix Reportedly Weighs Intel for HBM4E Base Dies amid TSMC Cost Pressure and Supply Diversification (trendforce.com)
- SK Hynix Reportedly Considers Intel HBM4E Base Chips, Seeking to Reduce Reliance on TSMC (tradingkey.com)
- SK hynix says US$4bn Factory will be a Key Production Base (businesschief.com)
- SK hynix breaks ground on $4 billion HBM plant in Indiana (upi.com)
- SK Hynix starts construction at site in US’ Indiana (taipeitimes.com)
- SK hynix to Start HBM4E Production at Indiana Plant in 2029 < Semiconductor < Article (thelec.net)
- SK Hynix to start AI chip output in Indiana in 2029, sees memory shortage through 2030 (reuters.com)
- SK hynix open to US investment, sees memory shortage through 2030 (koreaherald.com)
- SK hynix Holds Groundbreaking Ceremony for HBM Production Base in Indiana, “Beginning a New Future for US (news.skhynix.com)
- SK hynix to start HBM4E production in Indiana in 2029 (koreajoongangdaily.com)
- SK Hynix breaks ground on $4 billion semiconductor plant in West Lafayette (wrtv.com)
- SK hynix holds groundbreaking ceremony for HBM production base in U.S. (en.yna.co.kr)
- SK Hynix’s $4B West Lafayette facility takes next step toward late 2028 production (insideindianabusiness.com)
- SK Hynix CEO says Indiana will be key memory production base by 2030, first U.S. facility now underway (cnbc.com)
- SK Hynix breaks ground on $4 billion Indiana HBM plant (qz.com)
- SK Hynix to start US AI chip output in 2029, sees memory shortage through 2030 (koreatimes.co.kr)
- SK Hynix Moves a $4 Billion AI Bottleneck to Indiana (finance.yahoo.com)
- SK Hynix to start AI chip volume production in Indiana in 2029 (bnnbloomberg.ca)
- SK hynix Breaks Ground on U.S. HBM Fab in Indiana, Targets Mass Production by Q2 2029 (techpowerup.com)
- SK hynix breaks ground on $4 billion advanced packaging production facility in Purdue Research Park (purdue.edu)
- SK hynix launches Indiana chip packaging hub for first US-made HBM (koreaherald.com)
- SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility (srnnews.com)
- SK hynix Targets HBM Mass-Production in Indiana Fab by 2028 (businesskorea.co.kr)