SK Hynix Breaks Ground on $4 Billion Indiana HBM Packaging Facility
SK hynix has broken ground on a US$4 billion high bandwidth memory packaging facility in Indiana, marking its first advanced memory production hub in the United States. The site targets AI-driven memory demand, supports a Purdue University research and talent pipeline, and focuses on next-generation HBM4E packaging. A cleanroom opening is planned for October 2028, with volume production in Q3 2029.