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Samsung Unveils 3D Vertical Packaging to Target AI Memory Market

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Samsung Electronics unveiled next-generation 3D vertical packaging and a post-HBM memory roadmap to address AI chip bottlenecks. The company expects the global memory shortage to deepen in 2027 and last through 2028 as hyperscalers’ AI spending outstrips supply, while projecting HBM4 momentum and intensifying its push for Compute Express Link technology.

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