arstechnica.com

Samsung and TSMC embrace ASML’s high-NA EUV machines and photomask shift

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Samsung plans to use ASML’s high-NA EUV lithography machines for memory-chip production by 2028, while Samsung and TSMC plan to adopt the newest systems in the coming years. Samsung and TSMC, working with Intel and ASML, are also shifting photomasks from 6-inch to 12-inch, which ASML says could raise high-NA EUV productivity by about 40%.

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