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Intel Memory Patent Targets XBM Matching HBM4 Footprint Without Interposers

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Sig1.95Sen-0.75Env0.00Soc0.00Gov0.00

Intel and Micron formed the IMFT joint venture in 2006 to develop NAND flash alternatives such as 3D XPoint and Optane, but Optane was discontinued in 2022 as HBM and multilayer 3D-stacked memory outperformed on performance, cost, and scalability. A newly referenced Intel patent describes XBM matching an HBM4 footprint without interposers and targeting about twice the bandwidth density of HBM4, with commercialization expected after 2030.

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