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Intel Explores Packaging-Based Route Back Into Mainstream Memory

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Qualcomm and others pursue compute-to-memory designs, while Intel—long absent from mainstream memory manufacturing—studies a packaging-centric path instead of making DRAM. After selling its NAND/SSD business to SK Hynix (now Solidigm), Intel points to fine-pitch hybrid bonding via Foveros Direct, and to 18A-PT interconnects under 5 micrometers, using EMIB-T silicon-bridge routing to connect logic to HBM stacks.

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