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ASML, TSMC, Samsung and Intel Set AI Chip Manufacturing Roadmap Through 2033

ASML logoASML
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TSMC logoTSMC
Sig2.68Sen+2.90Env0.00Soc0.00Gov+0.04
Intel logoIntel
Sig3.44Sen+3.51Env+0.02Soc0.00Gov+0.06
Samsung logoSamsung
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ASML, TSMC, Samsung and Intel agreed on an AI chip manufacturing roadmap to 2033, targeting a 12-inch mask pilot line in 2031 and High-NA EUV systems entering advanced-node production by 2033. The machines cost about $400M each, and the plan aims to raise fab productivity and cut cost per chip for customers such as Nvidia, where 12-inch adoption aligns with TSMC’s 2030 timeline.

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