ASML and TSMC Plan Shift to 12-Inch EUV Photomasks
ASML and TSMC plan to drive semiconductor manufacturing toward larger 12-inch EUV lithography photomasks. High NA EUV systems will initially use six-inch masks, with 12-inch versions expected to improve fabrication productivity, ease design stitching limits, and lower unit costs for leading-edge chips. The larger format supports demand for smaller, faster, and more energy-efficient processors through sector collaboration.