Amkor Boosts Arizona Advanced Packaging Investment to About $12B
Amkor Technology is expanding its Arizona advanced packaging and test campus, lifting the planned investment to about $12 billion. Customer commitments have already exceeded Phase 1’s 33,000 square meters, supporting demand for wafer bump, probe, assembly and test. Phase 2 is expected to start in late 2027 and finish by end-2029, with the company expecting attractive returns, alongside a 10-year TSMC advanced packaging agreement and multi-year NVIDIA partnership.